Prototype to mid-volume bare boards built in our own Shenzhen plant, with DFM review, controlled impedance and IPC-standard inspection.
Quint Tech fabricates rigid, HDI, flex and rigid-flex PCBs in its own 12,000 m² Shenzhen plant — from fast-turn prototypes to mid-volume production. Every Gerber package receives a DFM (design-for-manufacturing) review before tooling, and boards are inspected to IPC standards before shipment.
| Rigid boards | 2–36 layers (samples); prototype to mid-volume production |
| Rigid-flex boards | Up to 18 layers (30 layers planned) |
| Minimum line width / space | 1.5 mil (HDI) |
| Minimum drilled via | 0.075 mm mechanical; 0.05 mm blind via |
| Maximum aspect ratio | 16:1 |
| Controlled impedance | ±5% |
| High-frequency materials | Rogers 4350B, PTFE and ceramic laminates |
| Heavy copper | Up to 5 oz inner/outer layers |
| Surface finishes | ENIG, HASL, OSP, immersion tin / silver, NiPdAu (ENEPIG) |
| Panel capability | Oversized panels to 555×545 mm (e.g. medical MRI boards) |
| Special processes | Half-hole (castellated), back-drilling, blind/buried vias, heavy gold plating |
Two-layer sample boards ship in as few as 5 working days, and complex 36-layer builds in around 9 days. There is no high-MOQ gate: engineering samples, pilot runs and production lots run on the same lines, so what you validate in prototyping is what you get in volume.
For RF, 5G and high-speed digital designs we process Rogers 4350B, PTFE and ceramic laminates with ±5% controlled impedance, lines down to 1.5 mil and mechanical vias down to 0.075 mm. Blind and buried vias, back-drilling and 0.05 mm blind microvias are standard in-house processes.
Rigid-flex builds up to 18 layers (30-layer capability planned) suit compact, high-reliability enclosures; heavy copper boards to 5 oz support power conversion, motor drives and energy systems. All common surface finishes are available, including ENIG and NiPdAu (ENEPIG).
| Board type | 2L | 4L | 6L | 8L | >10L |
|---|---|---|---|---|---|
| Rigid PCB — samples (working days) | 5 | 6 | 7 | 8 | 9 |
| Rigid PCB — production | 10 | 12 | 14 | 15 | 18 |
| Rigid-flex — samples | 10 | 12 | 14 | 14 | 16 |
| Rigid-flex — production | 14 | 14 | 16 | 18 | 20 |
Working days ex-factory. Special processes (half-hole, thick copper, back-drilling) add 1–3 days. SMT assembly samples typically ship in 3–5 days; volume PCBA in 20–30 days.
Automated imaging, lamination, drilling, plating and ENIG lines — not brokered capacity.
Gerber/RS-274X or ODB++ data, drill files, a stackup drawing (for multilayer and impedance boards), and the quantity per build. A panel drawing or mechanical outline helps for rigid-flex and oversized panels.
Yes. Bare boards come from our own PCB plant and assembly runs at our dedicated SMT facility — one contact handles the full PCBA. See our SMT assembly page.
Impedance is controlled to ±5% with coupon measurement and test reports from the in-house lab.
We currently export to Europe, North America, Japan and across Asia, with worldwide shipping on request.
Email Gerbers, BOM and pick&place files — complete RFQs are quoted within 24 hours.
jason.jin@quint-tech.com