High layer counts, heavy copper and mixed SMT/DIP builds for controllers, testers and power systems.
Industrial boards tend to be layer-heavy, mechanically substantial and built in smaller batches than consumer products — exactly the mix our plant is tooled for. We fabricate up to 36 rigid layers and build assemblies that combine dense SMT with through-hole power and relay sections.
Prototype to mid-volume is the company's core range: engineering samples in 5–9 days, mixed SMT/DIP assembly, X-ray on BGA, and functional test support with customer fixtures. Component sourcing for allocated industrial ICs is handled by the in-house sourcing team.

26 layers · 6.6 mm · heavy gold

4 layers · 5 oz · CTI > 600V

Mixed SMT / DIP assembly
Yes — 6.6 mm, 26-layer IC tester boards with heavy gold plating are a current production item; rigid samples run to 36 layers.
Three SMT lines plus two DIP lines cover mixed-technology boards in one flow, including relays and connectors typical of industrial controls.
Five test rigs run customer-supplied fixtures and defined functional checks.
Related: high-layer fabrication · mixed-tech assembly · automotive electronics
Email Gerbers, BOM and pick&place files — complete RFQs are quoted within 24 hours.
jason.jin@quint-tech.com